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| RO-P-DS-3022 - - 1.2W C/Ku-Band Power Amplifier 7.5-13.5 GHz Preliminary Information MAAPGM0038-DIE Features 7.5-13.5 GHz GaAs MMIC Amplifier 7.5-13.5 GHz Operation 1.2 Watt Saturated Output Power Level Variable Drain Voltage (4-10V) Operation Self-Aligned MSAG(R) MESFET Process Primary Applications Point-to-Point Weather Radar Airborne Radar Description The MAAPGM0038-DIE is a 3-stage 1.2 W power amplifier with on-chip bias networks. This product is fully matched to 50 ohms on both the input and output. It can be used as a power amplifier stage or as a driver stage in high power applications. Each device is 100% RF tested on wafer to ensure performance compliance. The part is fabricated using M/ A-COM's repeatable, high performance and highly reliable GaAs Multifunction Self-Aligned Gate (MSAG(R)) MESFET Process. This process features silicon nitride passivation and polyimide scratch protection. Electrical Characteristics: TB = 40C1, Z0 = 50 , VDD = 8V, VGG = -2V, Pin = 20 dBm Parameter Bandwidth Output Power Power Added Efficiency 1-dB Compression Point Small Signal Gain Input VSWR Gate Current Drain Current Output Third Order Intercept Noise Figure 2nd Harmonic 3rd Harmonic Symbol f POUT PAE P1dB G VSWR IGG IDD OTOI NF 2f 3f Typical 7.5-13.5 31 21 29 19 4:1 < 12 < 1.1 40 8 -17 -34 mA A dBm dB dBc dBc Units GHz dBm % dBm dB 1. TB = MMIC Base Temperature RO-P-DS-3022 - - 2/6 1.2W C/Ku-Band Power Amplifier Maximum Operating Conditions 1 Parameter Input Power Drain Supply Voltage Gate Supply Voltage Quiescent Drain Current (No RF) Quiescent DC Power Dissipated (No RF) Junction Temperature Storage Temperature Symbol PIN VDD VGG IDQ PDISS TJ TSTG Absolute Maximum 25.0 +12.0 -3.0 1.13 7.5 180 -55 to +150 MAAPGM0038-DIE Units dBm V V A W C C 1. Operation outside of these ranges may reduce product reliability. Operation at other than the typical values may result in performance outside the guaranteed limits. Recommended Operating Conditions Characteristic Drain Voltage Gate Voltage Input Power Junction Temperature MMIC Base Temperature Symbol VDD VGG PIN TJ TB Min 4.0 -2.3 Typ 8.0 -2.0 Max 10.0 -1.5 23.0 150 Note 2 Unit V V dBm C C 2. Maximum MMIC Base Temperature = 150C -- 10.7 C/W * VDD * IDQ Operating Instructions This device is static sensitive. Please handle with care. To operate the device, follow these steps. 1. Apply VGG = -2 V, VDD= 0 V. 2. Ramp VDD to desired voltage, typically 8 V. 3. Adjust VGG to set IDQ, (approximately @ -2 V). 4. Set RF input. 5. Power down sequence in reverse. Turn gate voltage off last. Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3022 - - 3/6 1.2W C/Ku-Band Power Amplifier 50 MAAPGM0038-DIE 50 POUT PAE 40 40 30 30 20 20 10 10 0 7 8 9 10 11 12 13 14 0 Frequency (GHz) Figure 1. Output Power and Power Added Efficiency vs. Frequency at VDD = 8V and Pin = 20 dBm. 50 POUT PAE 40 50 40 30 30 20 20 10 10 0 4 5 6 7 8 9 10 0 Drain Voltage (V) Figure 2. Saturated Output Power and Power Added Efficiency vs. Drain Voltage at fo = 10.5 GHz. Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3022 - - 4/6 1.2W C/Ku-Band Power Amplifier 50 MAAPGM0038-DIE VDD = 4 VDD = 8 40 VDD = 6 VDD = 10 30 20 10 0 7 8 9 10 11 12 13 14 Frequency (GHz) Figure 3. 1dB Compression Point vs. Drain Voltage 30 GAIN VSWR 25 5 6 20 4 15 3 10 2 5 7 8 9 10 11 12 13 14 1 Frequency (GHz) Figure 4. Small Signal Gain and Input VSWR vs. Frequency at VDD = 8V. Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3022 - - 5/6 1.2W C/Ku-Band Power Amplifier MAAPGM0038-DIE Mechanical Information Chip Size: 2.980 x 2.980 x 0.075 mm (117 x 117 x 3 mils) 0.127mm. 0.317mm. 2.303mm. 2.980mm. 2.980mm. 2.828mm. 2.828mm. VGG VDD 1.490mm. OUT 1.490mm. IN 0.152mm. 0 0 0.152mm. Chip edge to bond pad dimensions are shown to the center of the bond pad. Bond Pad Dimensions Pad RF In and Out DC Drain Supply Voltage VDD DC Gate Supply Voltage VGG Size (m) 100 x 200 200 x 150 150 x 150 Size (mils) 4x8 8x6 6x6 VGG VDD 2.303mm. 0.317mm. 2.853mm. Figure 5. Die Layout Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. RO-P-DS-3022 - - 6/6 1.2W C/Ku-Band Power Amplifier MAAPGM0038-DIE 100 pF 100 pF V VDD GG RFIN OUT IN VGG VDD RFOUT VGG 0.1 F 100 pF 100 pF 0.1 F VDD Figure 6. Recommended bonding diagram for pedestal mount. Support circuitry typical of MMIC characterization fixture for CW testing. Assembly Instructions: Die attach: Use AuSn (80/20) 1-2 mil. preform solder. Limit time @ 300 C to less than 5 minutes. Wirebonding: Bond @ 160 C using standard ball or thermal compression wedge bond techniques. For DC pad connections, use either ball or wedge bonds. For best RF performance, use wedge bonds of shortest length, although ball bonds are also acceptable. Biasing Note: Must apply negative bias to VGG before applying positive bias to VDD to prevent damage to amplifier. Specifications subject to change without notice. Customer Service: Tel. (888)-563-3949 Email: macom_adbu_ics@tycoelectronics.com North America: Tel. (800) 366-2266 Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020 V 1.00 Visit www.macom.com for additional data sheets and product information. |
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